Procedure：

Single-face panel process：
material sending ＝> drilling ＝> removing burr ＝>roundness transfer ＝> plating ＝> eroding board ＝> removing film ＝> etch check ＝> blocking soldering＝> character ＝> computer mill/mould rushing ＝>short circuit test ＝> final check ＝> soldering-can copper protection preparation ＝> sample examination＝> casing ＝> examination ＝> storing＝>delivery

Double-face panel process：
material sending ＝> drilling ＝> removing burr ＝> copper sinking＝> electroforming copper＝>board milling＝>roundness transfer ＝> plating ＝> eroding board ＝> etch check ＝> blocking soldering＝> character ＝> computer mill/mould rushing ＝> short circuit test ＝> final check ＝> sample examination＝> casing ＝> examination ＝>storing＝> delivery

multi-face panel process：
material sending ＝>lining making ＝>etch＝>press＝>drilling ＝>removing glue dregs＝> removing burr ＝>copper sinking ＝>electroforming copper＝>board milling＝>roundness transfer ＝> plating ＝>eroding board ＝> etch check ＝>blocking soldering ＝>character ＝> computer mill/mould rushing ＝> short circuit test ＝>final check ＝> sample examination＝> casing ＝> examination ＝>storing＝> delivery

The materials we can offer are: KB,DS,SY,PI，HR，NH, and so on.