Production technique's manufacturing ability (I)

• Material：94HB，FR-1, FR-2,CEM-1,CEM-3,FR-4
• Exterior Processing: nickel gold, stannum spray, Entek (soldering-can organic protecting preparation), electrogolding, carbon oiling, turmeric, stannum sinking
• Layers：the single-face board, the double-face board and the multi-layer board (one to ten layers)
• Size of general materials：40"×48" 36”×48“
• Thickness of materials：0.6mm～3.2mm
• Thickness of the copper foil：18ηm～70ηm
• Maximum size of the finished product：620mm×420mm（24.41"×16.54"）
• Minimum size of the finished product：25mm×27mm（0.98"×1.06"）
• Molding and tolerance： ±0.1mm（ ±4mil）computer mill， ±0.15（ ±6mil）mould rushing
• V-delve contraposition precision:±0.1mm（±4mil）

Production technique's manufacturing ability (II)

• V-delve angle warp:±5
• V-delve materials:0.38mm～3.2mm（15.0mil～126.0mil）
• Minimum aperture：drill：10mil（0.25mm） mould rushing：28mil（0.7mm）
• Minimum SMT space between:：4mil（0.1mm）
• Minimum aperture and tolerance：0.25mm/±0.076mm（10mil/±3mil）
• Minimum hole distance and tolerance：0.1mm/±0.025mm（4mil/±1mil）
• Minimum distance and width：4mils/4mils（0.1mm/0.1mm）
• Warp angle：single face1.0％，double face0.7％，multi-layer0.7％
• Minimum space between of welding boards：±0.05mm（±2mil
• The thickest sinking gold：0.00076mm（30η”）